SATOSHI ° NOSTR ° AI LLM ML ° LINUX ° MESH ° BUSINESS | HODLER TUTORIAL
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SATOSHI ° NOSTR ° AI LLM ML ° LINUX ° MESH ° BUSINESS | HODLER TUTORIAL
1.26K subscribers
SATOSHI ° NOSTR ° AI LLM ML ° LINUX ° MESH ° BUSINESS | HODLER TUTORIAL
#Chip_packaging
#Intel
#Thermal_control
#Noise_reduction
#Interconnects
source
IEEE Spectrum
Intel's Advanced Packaging for Bigger AI Chips
Intel's chip packaging R&D promise to enable massive silicon integration for AI. With Moore's Law slowing, could these advancements be the key to staying ahead in the AI race? #Intel #AI #ECTC…