insideHPC.com (Twitter)
Micron to Bring EUV Technology for Memory Manufacturing to Japan
https://wp.me/p3RLHQ-nP4
@MicronTech #HPC #MEMORY #highperformancememory
Micron to Bring EUV Technology for Memory Manufacturing to Japan
https://wp.me/p3RLHQ-nP4
@MicronTech #HPC #MEMORY #highperformancememory
High-Performance Computing News Analysis | insideHPC
Micron to Bring EUV Technology for Memory Manufacturing to Japan
HIROSHIMA, Japan, May 17, 2023 — Micron Technology, Inc. (Nasdaq: MU) announced today it will introduce extreme ultraviolet (EUV) technology to [...]
insideHPC.com (Twitter)
Micron Sampling 8-high 24GB HBM3 Gen2 with Bandwidth Over 1.2TB/s
https://t.co/7JE3YXiMsa
@MicronTech #HPC #HBM #HBM3 #memory
Micron Sampling 8-high 24GB HBM3 Gen2 with Bandwidth Over 1.2TB/s
https://t.co/7JE3YXiMsa
@MicronTech #HPC #HBM #HBM3 #memory
High-Performance Computing News Analysis | insideHPC
Micron Sampling 8-high 24GB HBM3 Gen2 with Bandwidth Over 1.2TB/s
BOISE, Idaho, July 26, 2023 — Micron Technology, Inc. (Nasdaq: MU) today announced it has begun sampling what the company said is the industry’s [...]
HPC Guru (Twitter)
#AI Boom Sees Memory Makers Ramp Up #HBM Production
Additional HBM production capacities will only come online in Q2 2024
https://t.co/ytRxvM6qu7
#HPC #Memory #GPU @SKhynix @samsung @MicronTech
via @tomshardware @ogawa_tter
#AI Boom Sees Memory Makers Ramp Up #HBM Production
Additional HBM production capacities will only come online in Q2 2024
https://t.co/ytRxvM6qu7
#HPC #Memory #GPU @SKhynix @samsung @MicronTech
via @tomshardware @ogawa_tter
Twitter
=>
Suppliers Amp Up Production, HBM Bit Supply Projected to Soar by 105% in 2024, Says TrendForce, Aug 9, 2023 https://t.co/eCkIPOi88O
2022, 2023 (E), 2024 (E)
HBM2: 70, 📉50, 📉25%
HBM3: 8, 📈39, 📈60%
SK hynix: 50, 46-49, 47-49%
Samsun: 40, 46-49, 47-49%
Micron:…
Suppliers Amp Up Production, HBM Bit Supply Projected to Soar by 105% in 2024, Says TrendForce, Aug 9, 2023 https://t.co/eCkIPOi88O
2022, 2023 (E), 2024 (E)
HBM2: 70, 📉50, 📉25%
HBM3: 8, 📈39, 📈60%
SK hynix: 50, 46-49, 47-49%
Samsun: 40, 46-49, 47-49%
Micron:…
insideHPC.com (Twitter)
Samsung Announces 12nm-Class 32Gb DDR5 DRAM
wp.me/p3RLHQ-nZZ
@Samsung #HPC #DRAM #memory
Samsung Announces 12nm-Class 32Gb DDR5 DRAM
wp.me/p3RLHQ-nZZ
@Samsung #HPC #DRAM #memory
High-Performance Computing News Analysis | insideHPC
Samsung Announces 12nm-Class 32Gb DDR5 DRAM
SEOUL, Korea – Sept. 1, 2023 – Samsung Electronics today said it has developed the industry's first 32-gigabit (Gb) DDR5 DRAM using 12 nanometer [...]
HPC Guru (Twitter)
Next gen #HBM4 could see an increase from 1024 to 2048 bits in the #memory interface
tomshardware.com/news/hbm4-2…
#HPC #AI via @tomshardware
Next gen #HBM4 could see an increase from 1024 to 2048 bits in the #memory interface
tomshardware.com/news/hbm4-2…
#HPC #AI via @tomshardware
insideHPC.com (Twitter)
Astera Labs Says Its CXL Memory Controller Boosts Server Memory Bandwidth by 50%
wp.me/p3RLHQ-o1M
@AsteraLabs @intelhpc #HPC #memory #memorybandwidth
Astera Labs Says Its CXL Memory Controller Boosts Server Memory Bandwidth by 50%
wp.me/p3RLHQ-o1M
@AsteraLabs @intelhpc #HPC #memory #memorybandwidth
High-Performance Computing News Analysis | insideHPC
Astera Labs Says Its CXL Memory Controller Boosts Server Memory Bandwidth by 50%
Astera Labs today said its Leo Memory Connectivity Platform is the industry’s first Compute Express Link (CXL) memory controller that increases server [...]
HPC Guru (Twitter)
.@MicronTech starts construction on the nation’s first new #memory manufacturing fab in 20 years
The $15B fab in Boise is to have a 600,000 sq ft #cleanroom at its completion, the largest single cleanroom ever built in the US
investors.micron.com/news-re…
#HPC #AI via @dnystedt
.@MicronTech starts construction on the nation’s first new #memory manufacturing fab in 20 years
The $15B fab in Boise is to have a 600,000 sq ft #cleanroom at its completion, the largest single cleanroom ever built in the US
investors.micron.com/news-re…
#HPC #AI via @dnystedt
X (formerly Twitter)
#memory - Search / X
See posts about #memory on X. See what people are saying and join the conversation.
HPC Guru (Twitter)
.@MicronTech announces 32Gb monolithic die-based 128GB #DDR5 RDIMM #memory with performance of up to 8000 MT/s to support data center workloads
investors.micron.com/news-re…
#HPC #AI #GenAI
.@MicronTech announces 32Gb monolithic die-based 128GB #DDR5 RDIMM #memory with performance of up to 8000 MT/s to support data center workloads
investors.micron.com/news-re…
#HPC #AI #GenAI
HPC Guru (Twitter)
#HBM suppliers and the HBM standards body are looking at ways to speed HBM-to-processor access speeds by using technologies such as photonics or directly mounting the HBM on the processor die
blocksandfiles.com/2023/11/2…
#HPC #AI #Memory via @BlocksandFiles
#HBM suppliers and the HBM standards body are looking at ways to speed HBM-to-processor access speeds by using technologies such as photonics or directly mounting the HBM on the processor die
blocksandfiles.com/2023/11/2…
#HPC #AI #Memory via @BlocksandFiles
X (formerly Twitter)
#HBM - Search / X
See posts about #HBM on X. See what people are saying and join the conversation.
HPC Guru (Twitter)
SNIA Webinar: Emerging Memories Branch Out
SNIA CMSI members and leading experts discuss the latest developments in MRAM, ReRAM, FRAM, PCM, and other new #memory technologies
Slides: https://www.snia.org/sites/default/files/event-calendar/2024-0122_SNIA_CMSI_Emerging_Memories_Webinar.pdf
https://www.youtube.com/watch?v=watch?v=1JhUIABbK5I
#HPC #AI via @ogawa_tter
SNIA Webinar: Emerging Memories Branch Out
SNIA CMSI members and leading experts discuss the latest developments in MRAM, ReRAM, FRAM, PCM, and other new #memory technologies
Slides: https://www.snia.org/sites/default/files/event-calendar/2024-0122_SNIA_CMSI_Emerging_Memories_Webinar.pdf
https://www.youtube.com/watch?v=watch?v=1JhUIABbK5I
#HPC #AI via @ogawa_tter
X (formerly Twitter)
HPC Guru (@HPC_Guru) on X
SNIA Webinar: Emerging Memories Branch Out
SNIA CMSI members and leading experts discuss the latest developments in MRAM, ReRAM, FRAM, PCM, and other new #memory technologies
Slides: https://t.co/VV9jYeKXKG
https://t.co/lVC0cfm8eA
#HPC #AI via @ogawa_tter
SNIA CMSI members and leading experts discuss the latest developments in MRAM, ReRAM, FRAM, PCM, and other new #memory technologies
Slides: https://t.co/VV9jYeKXKG
https://t.co/lVC0cfm8eA
#HPC #AI via @ogawa_tter
HPC Guru (Twitter)
RT @filippospiga: NVIDIA HPC SDK 24.1 is out! Two important additions: 1) #cuBLASmp (basically PBLAS for GPU); and 2) "-gpu=unified" for better use of #Unified #Memory (must have for #GH200). -- @nvidia @NVIDIAHPCDev
RT @filippospiga: NVIDIA HPC SDK 24.1 is out! Two important additions: 1) #cuBLASmp (basically PBLAS for GPU); and 2) "-gpu=unified" for better use of #Unified #Memory (must have for #GH200). -- @nvidia @NVIDIAHPCDev
HPC Guru (Twitter)
Samsung names new CEO (Device Solution) as company loses market share to SK hynix, hopes to retake ground as #AI demand for #memory increases
Samsung has a dual-CEO system, with one CEO over the semiconductor business and the other over device experience
https://www.tomshardware.com/tech-industry/samsung-names-new-ceo-as-company-loses-market-share-to-sk-hynix-hopes-to-retake-ground-as-ai-demand-for-memory-increases
Samsung names new CEO (Device Solution) as company loses market share to SK hynix, hopes to retake ground as #AI demand for #memory increases
Samsung has a dual-CEO system, with one CEO over the semiconductor business and the other over device experience
https://www.tomshardware.com/tech-industry/samsung-names-new-ceo-as-company-loses-market-share-to-sk-hynix-hopes-to-retake-ground-as-ai-demand-for-memory-increases
X (formerly Twitter)
HPC Guru (@HPC_Guru) on X
Samsung names new CEO (Device Solution) as company loses market share to SK hynix, hopes to retake ground as #AI demand for #memory increases
Samsung has a dual-CEO system, with one CEO over the semiconductor business and the other over device experience…
Samsung has a dual-CEO system, with one CEO over the semiconductor business and the other over device experience…
HPC Guru (Twitter)
RT @SAFARI_ETH_CMU: Join us tomorrow for an invited talk by @_onurmutlu_ on "Memory-Centric Computing" at the @Stanford SystemX Seminar in April.
Talk Details:
Premiere Friday May 24 5PM CEST:
https://invidious.poast.org/Boii0AwOoiU?feature=shared
@_onurmutlu_ @StanfordEng #memory #computing
RT @SAFARI_ETH_CMU: Join us tomorrow for an invited talk by @_onurmutlu_ on "Memory-Centric Computing" at the @Stanford SystemX Seminar in April.
Talk Details:
Premiere Friday May 24 5PM CEST:
https://invidious.poast.org/Boii0AwOoiU?feature=shared
@_onurmutlu_ @StanfordEng #memory #computing
HPC Guru (Twitter)
.@SKhynix plans $74.6 billion investment to strengthen its #memory chip business in anticipation for #AI business boost
This investment is on top of the company’s $90 billion ‘mega fab complex’ currently under construction
https://www.tomshardware.com/tech-industry/sk-hynix-plans-dollar746-billion-investment-to-strengthen-its-memory-chip-business-hopes-for-ai-business-boost
#HPC via @tomshardware
.@SKhynix plans $74.6 billion investment to strengthen its #memory chip business in anticipation for #AI business boost
This investment is on top of the company’s $90 billion ‘mega fab complex’ currently under construction
https://www.tomshardware.com/tech-industry/sk-hynix-plans-dollar746-billion-investment-to-strengthen-its-memory-chip-business-hopes-for-ai-business-boost
#HPC via @tomshardware
X (formerly Twitter)
#memory - Search / X
See posts about #memory on X. See what people are saying and join the conversation.
HPC Guru (Twitter)
RT @SKhynix: 🚨 Breaking News! 🚨 @SKhynix signs #PMT with U.S. Dept of Commerce for an #HBM packaging plant and advanced R&D facility in Indiana. Up to $450M in federal incentives under the CHIPS Act.
For more: https://news.skhynix.com/preliminary-mou-terms-signed-with-us-doc-for-advanced-packaging-facility-in-indiana/
#SKhynix #HBM3E #Packaging #AI #Memory #Indiana
RT @SKhynix: 🚨 Breaking News! 🚨 @SKhynix signs #PMT with U.S. Dept of Commerce for an #HBM packaging plant and advanced R&D facility in Indiana. Up to $450M in federal incentives under the CHIPS Act.
For more: https://news.skhynix.com/preliminary-mou-terms-signed-with-us-doc-for-advanced-packaging-facility-in-indiana/
#SKhynix #HBM3E #Packaging #AI #Memory #Indiana
HPCwire (Twitter)
Last week in #HPC: AMD released ROCm 6.2. FMS featured key innovations in #Memory and #Storage. Novo Nordisk and Cleveland Clinic launched a quantum tech + AI fellowship. And SC24 Test of Time Award goes to GPU cluster paper that shaped #Supercomputing
ow.ly/gwYO50SVLzK
Last week in #HPC: AMD released ROCm 6.2. FMS featured key innovations in #Memory and #Storage. Novo Nordisk and Cleveland Clinic launched a quantum tech + AI fellowship. And SC24 Test of Time Award goes to GPU cluster paper that shaped #Supercomputing
ow.ly/gwYO50SVLzK
insideHPC.com (Twitter)
Memory: CEA-Leti Demonstrates Embedded FeRAM Platform Compatible with 22nm FD-SOI Node
wp.me/p3RLHQ-oND
@CEA_Officiel #memory #embeddedtech
Memory: CEA-Leti Demonstrates Embedded FeRAM Platform Compatible with 22nm FD-SOI Node
wp.me/p3RLHQ-oND
@CEA_Officiel #memory #embeddedtech
High-Performance Computing News Analysis | insideHPC
Memory: CEA-Leti Demonstrates Embedded FeRAM Platform Compatible with 22nm FD-SOI Node
SAN FRANCISCO – Dec. 10, 2024 – CEA-Leti research engineers in France have demonstrated for the first time a scalable hafnia-zirconia-based ferroelectric [...]
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HPC Guru (Twitter)
RT @SKhynix: Meet the world’s first 12-layer stacked HBM3E! A tiny chip, 36GB capacity, and unmatched performance. The future of AI servers starts here.
#HBM3 #HBM3E #Memory
RT @SKhynix: Meet the world’s first 12-layer stacked HBM3E! A tiny chip, 36GB capacity, and unmatched performance. The future of AI servers starts here.
#HBM3 #HBM3E #Memory