HPC Guru (Twitter)
.@AMD patents a #chiplet #GPU design quite unlike Nvidia and Intel's
https://www.techspot.com/news/88138-amd-patents-chiplet-gpu-design-unlike-nvidia-intel.html
#HPC #AI
.@AMD patents a #chiplet #GPU design quite unlike Nvidia and Intel's
https://www.techspot.com/news/88138-amd-patents-chiplet-gpu-design-unlike-nvidia-intel.html
#HPC #AI
HPCwire (Twitter)
OpenFive Launches Die-to-Die Interface Solution for Chiplet Ecosystem
http://ow.ly/FnbB50EieDI #HPC #AI #Chiplet
OpenFive Launches Die-to-Die Interface Solution for Chiplet Ecosystem
http://ow.ly/FnbB50EieDI #HPC #AI #Chiplet
HPC Guru (Twitter)
Rob Farber (@techEnablement) : Bespoke #supercomputers and #HPC will adopt #chiplet technology to benefit us all
Chiplets mean on-premises can outpace COTS HPC in the #Cloud
https://www.datacenterdynamics.com/en/opinions/chiplets-will-revolutionize-the-hpc-sector/
via @nanduri_anil @intelhpc
Rob Farber (@techEnablement) : Bespoke #supercomputers and #HPC will adopt #chiplet technology to benefit us all
Chiplets mean on-premises can outpace COTS HPC in the #Cloud
https://www.datacenterdynamics.com/en/opinions/chiplets-will-revolutionize-the-hpc-sector/
via @nanduri_anil @intelhpc
Datacenterdynamics
Chiplets will revolutionize the HPC sector
Bespoke supercomputers and HPC will adopt chiplet technology to benefit us all
HPC Guru (Twitter)
TSMC Forms 3DFabric Alliance to Accelerate Development of 2.5D & 3D #Chiplet Products
The alliance currently has 19 members, but expected to expand over time
https://www.anandtech.com/show/17626/tsmc-forms-3dfabric-alliance-to-accelerate-development-of-25d-3d-chiplet-products
#HPC #AI via @anandtech
TSMC Forms 3DFabric Alliance to Accelerate Development of 2.5D & 3D #Chiplet Products
The alliance currently has 19 members, but expected to expand over time
https://www.anandtech.com/show/17626/tsmc-forms-3dfabric-alliance-to-accelerate-development-of-25d-3d-chiplet-products
#HPC #AI via @anandtech
HPCwire (Twitter)
The Universal Chiplet Interconnect Express revealed the first #bandwidth speed between #chiplets at #ISC2023. Learn about #chiplet packages and bandwidth here: https://t.co/6HnssWhrgP https://t.co/IDMvoGHa4I
The Universal Chiplet Interconnect Express revealed the first #bandwidth speed between #chiplets at #ISC2023. Learn about #chiplet packages and bandwidth here: https://t.co/6HnssWhrgP https://t.co/IDMvoGHa4I
HPCwire
For the First Time, UCIe Shares Bandwidth Speeds Between Chiplets
The first numbers of the available bandwidth between chiplets is out – UCIe is estimating that chiplet packages could squeeze out communication speeds of 630Gbps, or 0.63Tbps, in a very tight area. That number was shared by the Universal Chiplet Interconnect…
HPCwire (Twitter)
@AMD’s CEO @LisaSu explained its #MI300X #GPU and 128-core Epyc #CPU, codenamed Bergamo. Read about the company’s updates on its #chiplet technology. https://ow.ly/l4lr50OT1si
@AMD’s CEO @LisaSu explained its #MI300X #GPU and 128-core Epyc #CPU, codenamed Bergamo. Read about the company’s updates on its #chiplet technology. https://ow.ly/l4lr50OT1si
HPC Guru (Twitter)
What @AMD Learned From Its Big #Chiplet Push
Sam Naffziger, an early evangelist for breaking up silicon chips, answers questions by @IEEESpectrum
https://spectrum.ieee.org/chiplet
#HPC #AI
What @AMD Learned From Its Big #Chiplet Push
Sam Naffziger, an early evangelist for breaking up silicon chips, answers questions by @IEEESpectrum
https://spectrum.ieee.org/chiplet
#HPC #AI
IEEE Spectrum
What AMD Learned From Its Big Chiplet Push
Sam Naffziger was an early evangelist for breaking up silicon chips
HPC Guru (Twitter)
Congratulations @LisaSu and @AMD on receiving the 2024 @IEEEorg Corporate Innovation Award for #chiplet designs for #HPC
corporate-awards.ieee.org/re… https://twitter.com/LisaSu/status/1731742444965011749#m
Congratulations @LisaSu and @AMD on receiving the 2024 @IEEEorg Corporate Innovation Award for #chiplet designs for #HPC
corporate-awards.ieee.org/re… https://twitter.com/LisaSu/status/1731742444965011749#m
HPC Guru (Twitter)
#Chiplet technologies will blur the lines between server products and client products, and chip making will be a matter of patching together the right parts based on what clients want: @intel CEO @PGelsinger
https://www.hpcwire.com/2024/01/15/intels-server-and-pc-chip-development-will-blur-after-2025/
#HPC #AI via @agamsh @HPCwire
#Chiplet technologies will blur the lines between server products and client products, and chip making will be a matter of patching together the right parts based on what clients want: @intel CEO @PGelsinger
https://www.hpcwire.com/2024/01/15/intels-server-and-pc-chip-development-will-blur-after-2025/
#HPC #AI via @agamsh @HPCwire
insideHPC.com (Twitter)
Cadence and Intel Foundry Partner on EMIB Packaging for Heterogeneous Integration
wp.me/p3RLHQ-ok6
@Cadence @intelhpc #IntelFoundry #HPC #chiplet
Cadence and Intel Foundry Partner on EMIB Packaging for Heterogeneous Integration
wp.me/p3RLHQ-ok6
@Cadence @intelhpc #IntelFoundry #HPC #chiplet
High-Performance Computing News Analysis | insideHPC
Cadence and Intel Foundry Partner on EMIB Packaging for Heterogeneous Integration
Feb. 21, 2024 — EDA software company Cadence and Intel Foundry have collaborated to develop an integrated advanced packaging flow utilizing Embedded [...]
HPC Guru (Twitter)
Arm, Samsung Foundry, ADTechnology and Rebellions have partnered to launch an AI/CPU #chiplet platform that targets the #cloud, #HPC, and #AI/ML training and inference workloads
https://www.eetimes.com/arm-aims-to-democratize-chiplets/
Arm, Samsung Foundry, ADTechnology and Rebellions have partnered to launch an AI/CPU #chiplet platform that targets the #cloud, #HPC, and #AI/ML training and inference workloads
https://www.eetimes.com/arm-aims-to-democratize-chiplets/
HPC Guru (Twitter)
RT @thoefler: 🎥: Proximity is all you need - cool tricks for chiplets! Introducing HexaMesh tiling and Folded HexaTorus architecture to reduce network diameter and achieve symmetric, six-neighbor connectivity. Evaluate designs with RapidChiplet. #Chiplet #HPC #AI
https://www.youtube.com/watch?v=YimAAXqj7cg
RT @thoefler: 🎥: Proximity is all you need - cool tricks for chiplets! Introducing HexaMesh tiling and Folded HexaTorus architecture to reduce network diameter and achieve symmetric, six-neighbor connectivity. Evaluate designs with RapidChiplet. #Chiplet #HPC #AI
https://www.youtube.com/watch?v=YimAAXqj7cg