Xiaomi 14 is coming to India
Xiaomi 14 and 14 Ultra will launch globally on 25th March at Xiaomi's MWC event.
Xiaomi will bring Xiaomi 14 to India on 7th March
Xiaomi 14 Ultra has NOT been teased for the Indian region because its launch in India will depend upon how well Xiaomi 14 sells in India
Well, even Xiaomi understands that who gonna spend Rs.1 Lakh on a Xiaomi Phone in India wherein competitors like Samsung, Apple, and Pixel exist
However, Xiaomi can do a limited drop for the India region like they did JUST 3000 units available for Mi 11 Ultra in India
Ironically, Xiaomi 11 Ultra turned out to be the WORST Flagship ever too with issues with Wi-FI, motherboard, SoC and IP68 rating as well
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Xiaomi 14 and 14 Ultra will launch globally on 25th March at Xiaomi's MWC event.
Xiaomi will bring Xiaomi 14 to India on 7th March
Xiaomi 14 Ultra has NOT been teased for the Indian region because its launch in India will depend upon how well Xiaomi 14 sells in India
Well, even Xiaomi understands that who gonna spend Rs.1 Lakh on a Xiaomi Phone in India wherein competitors like Samsung, Apple, and Pixel exist
However, Xiaomi can do a limited drop for the India region like they did JUST 3000 units available for Mi 11 Ultra in India
Ironically, Xiaomi 11 Ultra turned out to be the WORST Flagship ever too with issues with Wi-FI, motherboard, SoC and IP68 rating as well
Follow @TechLeaksZone
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Here is what's NEW with Dimensity-7200 Pro used in Phone 2a
Carl Pei claimed that Phone 2a does NOT feature a MediaTek Dimenisty 7200 but instead comes with Dimensity 7200-"Pro" which as per them is "custom" built and "exclusively co-engineered with Nothing"
So, this means that there should be something different than the base Dimensity-7200
But, the answer is absolutely NOTHING
The clock speeds, GPU, etc. everything is SAME as the base Dimensity-7200 only
There has been virtually NO customization done with the 7200-"Pro" used in Phone 2a.
Basically, MediaTek offers "custom monikers to OEMs" who are ready to pay extra for certain software optimizations.
So to create HYPE for the Phone 2a, Carl Pei ended up paying MediaTek a bit more for certain software optimization & in return MediaTek allowed them to use custom-moniker for the same SoC and Nothing & then called it an "exclusive and custom" chip
Average Garbage marketing and FAKE Hype once again by Nothing to Fool Peeps
Follow @TechLeaksZone
Carl Pei claimed that Phone 2a does NOT feature a MediaTek Dimenisty 7200 but instead comes with Dimensity 7200-"Pro" which as per them is "custom" built and "exclusively co-engineered with Nothing"
So, this means that there should be something different than the base Dimensity-7200
But, the answer is absolutely NOTHING
The clock speeds, GPU, etc. everything is SAME as the base Dimensity-7200 only
There has been virtually NO customization done with the 7200-"Pro" used in Phone 2a.
Basically, MediaTek offers "custom monikers to OEMs" who are ready to pay extra for certain software optimizations.
So to create HYPE for the Phone 2a, Carl Pei ended up paying MediaTek a bit more for certain software optimization & in return MediaTek allowed them to use custom-moniker for the same SoC and Nothing & then called it an "exclusive and custom" chip
Average Garbage marketing and FAKE Hype once again by Nothing to Fool Peeps
Follow @TechLeaksZone
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Tech & Leaks Zone
Here is what's NEW with Dimensity-7200 Pro used in Phone 2a Carl Pei claimed that Phone 2a does NOT feature a MediaTek Dimenisty 7200 but instead comes with Dimensity 7200-"Pro" which as per them is "custom" built and "exclusively co-engineered with Nothing"β¦
Learn from Carl Pei
> Create FAKE Hype
> The Hype worked!
> People caught that it was just for marketing
> People called the hype as CRINGE!
> After hype worked & some people caught, accept it was Super Cringe
> Apologize
> Create FAKE Hype
> The Hype worked!
> People caught that it was just for marketing
> People called the hype as CRINGE!
> After hype worked & some people caught, accept it was Super Cringe
> Apologize
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Snapdragon 8s Gen 3 spotted on Geekbench 6
A Realme device (RMX3851) possibly Realme GT Neo 6/ Neo 6 SE has spotted on Geekbench 6 with Snapdragon 8s Gen 3 (SM-8635)
Geekbench 6 scores
Single-core: 1638
Multi-core: 3991
SM-8635 CPU:
1x Cortex-X4 @ 3.0GHz
4x Cortex-A720 2.6GHz
3x Cortex-X520 1.8GHz
GPU: Adreno 735 at 9xx MHz
Same architecture as Snapdragon 8 gen 3
Snapdragon 8 Gen 2 (SM-8550):
1x Cortex-X3 @ 3.2GHz
4x Cortex-A715 2.8GHz
3x Cortex-X515 2.0GHz
So Snapdragon 8s Gen 3 will be SLOWER than the Snapdragon 8 Gen 2, thus will perform similar to Snapdragon 8 Plus Gen 1
JUST Qualcomm garbage naming scheme
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A Realme device (RMX3851) possibly Realme GT Neo 6/ Neo 6 SE has spotted on Geekbench 6 with Snapdragon 8s Gen 3 (SM-8635)
Geekbench 6 scores
Single-core: 1638
Multi-core: 3991
SM-8635 CPU:
1x Cortex-X4 @ 3.0GHz
4x Cortex-A720 2.6GHz
3x Cortex-X520 1.8GHz
GPU: Adreno 735 at 9xx MHz
Same architecture as Snapdragon 8 gen 3
Snapdragon 8 Gen 2 (SM-8550):
1x Cortex-X3 @ 3.2GHz
4x Cortex-A715 2.8GHz
3x Cortex-X515 2.0GHz
So Snapdragon 8s Gen 3 will be SLOWER than the Snapdragon 8 Gen 2, thus will perform similar to Snapdragon 8 Plus Gen 1
JUST Qualcomm garbage naming scheme
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Samsung collaborated with ARM for Next-Gen Cortex -X cores
Samsung Newsroom
Samsung Foundry has announced its collaboration with ARM for optimized fabrication of next-generation Cortex-X series CPU cores (likely the Cortex-X5 and above), thus improving the performance and power efficiency of ARM's latest Cortex-CPU cores
"Samsung Foundry will deliver the next generation Arm Cortex-X CPU optimized on Samsung Foundryβs latest Gate-All-Around (GAA) process technology on its 3nm as well as 2nm processes
This initiative is built on years of partnership with millions of devices shipped with Arm CPU intellectual property (IP) on various process nodes offered by Samsung Foundry."
The companies have bold plans to reinvent 2-nanometer (nm) GAA for next-generation data center and infrastructure custom silicon, as well as a groundbreaking AI chiplet solution.
The Exynos 2500 chip (internally dream chip) will pack the cortex-X5 core
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Samsung Newsroom
Samsung Foundry has announced its collaboration with ARM for optimized fabrication of next-generation Cortex-X series CPU cores (likely the Cortex-X5 and above), thus improving the performance and power efficiency of ARM's latest Cortex-CPU cores
"Samsung Foundry will deliver the next generation Arm Cortex-X CPU optimized on Samsung Foundryβs latest Gate-All-Around (GAA) process technology on its 3nm as well as 2nm processes
This initiative is built on years of partnership with millions of devices shipped with Arm CPU intellectual property (IP) on various process nodes offered by Samsung Foundry."
The companies have bold plans to reinvent 2-nanometer (nm) GAA for next-generation data center and infrastructure custom silicon, as well as a groundbreaking AI chiplet solution.
The Exynos 2500 chip (internally dream chip) will pack the cortex-X5 core
Follow @TechLeaksZone
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Forwarded from Mishaal's Android News Feed
Android's Virtualization Framework seems to be getting GPU support.
"Enable GPU feature. crosvm in virt APEX now supports GPU feature. This is to support VMs with display."
AVF was introduced in Android 13 and supported on select Pixels but is now supported by a variety of non-Pixel phones running Android 14. It's still only accessible to system apps, though with root, you can theoretically run your own VM.
Developer Danny Lin famously managed to get Windows 11 on ARM booting in a VM on his Pixel 6 two years ago (wow time sure flies), but at the time, there was no graphics acceleration.
"Enable GPU feature. crosvm in virt APEX now supports GPU feature. This is to support VMs with display."
AVF was introduced in Android 13 and supported on select Pixels but is now supported by a variety of non-Pixel phones running Android 14. It's still only accessible to system apps, though with root, you can theoretically run your own VM.
Developer Danny Lin famously managed to get Windows 11 on ARM booting in a VM on his Pixel 6 two years ago (wow time sure flies), but at the time, there was no graphics acceleration.
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Forwarded from Mishaal's Android News Feed
Google is preparing to fully remove support for non-A/B updates from Android, leaving A/B updates as the only officially supported OTA update mechanism moving forward.
However, this won't stop certain device makers from continuing to use non-A/B as they can either use their own implementation or just revert Google's changes. Google would need to actually mandate the use of A/B through the CDD or GMS licensing, which they've tried to do but ended up reneging.
If you want to learn more about how Android's update schemes work, check out this article I wrote (though note that Google ended up not going forward with this requirement).
However, this won't stop certain device makers from continuing to use non-A/B as they can either use their own implementation or just revert Google's changes. Google would need to actually mandate the use of A/B through the CDD or GMS licensing, which they've tried to do but ended up reneging.
If you want to learn more about how Android's update schemes work, check out this article I wrote (though note that Google ended up not going forward with this requirement).
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Google Pixel Fold 2 Renders
Source
The internal display will measure 7.9" (8.1-inch with corners)
The outer display however will be 6.4" (6.6-inch with corners)
This indicates that Pixel Fold 2 display will be bigger than that of Pixel Fold 1
Also, Google might use the same flagship display that will be used on the Samsung Galaxy Z Fold 6
Additionally, Pixel Fold 2 internal display will also feature a Under Display Camera (UDC) as visible in the top right corner in the renders
The camera module arranged in a rectangular cutout on the rear side consists of 3 cameras (wide + Ultrawide+ Telephoto) along with a 4th unnamed sensor.
Dimensions
Folded: 155.2 x 77.1 x 10.54mm
Unfolded: 155.2 x 150.2 x 5.27mm
Pixel Fold 2 will feature the upcoming Google Tensor G4 SoC with 16GB LPDDR5X RAM and faster UFS 4.0 storage.
Pixel Fold 2 is expected to debut in October, 2024 along with the Pixel 9 series with Android 15 out of the box
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Source
The internal display will measure 7.9" (8.1-inch with corners)
The outer display however will be 6.4" (6.6-inch with corners)
This indicates that Pixel Fold 2 display will be bigger than that of Pixel Fold 1
Also, Google might use the same flagship display that will be used on the Samsung Galaxy Z Fold 6
Additionally, Pixel Fold 2 internal display will also feature a Under Display Camera (UDC) as visible in the top right corner in the renders
The camera module arranged in a rectangular cutout on the rear side consists of 3 cameras (wide + Ultrawide+ Telephoto) along with a 4th unnamed sensor.
Dimensions
Folded: 155.2 x 77.1 x 10.54mm
Unfolded: 155.2 x 150.2 x 5.27mm
Pixel Fold 2 will feature the upcoming Google Tensor G4 SoC with 16GB LPDDR5X RAM and faster UFS 4.0 storage.
Pixel Fold 2 is expected to debut in October, 2024 along with the Pixel 9 series with Android 15 out of the box
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Tech & Leaks Zone
iQOO Neo 9 launched in China Common Specs: β’ 6.78" 1.5K resolution 8T circuit Visionox LTPO OLED display β’ 1~144Hz Variable refresh rate β’ 2160Hz PWM dimming β’ HDR 10+ certified β’ 1400nits peak brightness β’ iQOO Q1 display chip Neo 9 Pro: MediaTek Dimensityβ¦
iQOO Neo 9 Pro launched in India
Specifications:
β’ 6.78" 1.5K resolution 8T circuit Visionox LTPO OLED display
β’ 1~144Hz Variable refresh rate
β’ iQOO Q1 display chip
β’ Snapdragon 8 Gen 2 SoC
β’ 6K VC liquid-cooling chamber
β’ 50MP main (IMX 920 VCS Bionic, OIS)
β’ 5160mAh battery with 120W fast charging
Click HERE for Full details
3 Android OS + 4yrs Security Patches
18 months warranty
NFC β
8GB RAM with 128GB storage model comes with UFS 3.1 storage and 256GB model comes with UFS 4.0 storage
Pricing
8GB + 128GB = Rs.36,000 (~435$)
8GB + 256GB = Rs.38,000 (~450$)
12GB + 256GB = Rs.40,000 (~480$)
In China, Neo 9 Pro is available with 12GB RAM in the base model at just 320$
Follow @TechLeaksZone
Specifications:
β’ 6.78" 1.5K resolution 8T circuit Visionox LTPO OLED display
β’ 1~144Hz Variable refresh rate
β’ iQOO Q1 display chip
β’ Snapdragon 8 Gen 2 SoC
β’ 6K VC liquid-cooling chamber
β’ 50MP main (IMX 920 VCS Bionic, OIS)
β’ 5160mAh battery with 120W fast charging
Click HERE for Full details
3 Android OS + 4yrs Security Patches
18 months warranty
NFC β
8GB RAM with 128GB storage model comes with UFS 3.1 storage and 256GB model comes with UFS 4.0 storage
Pricing
8GB + 128GB = Rs.36,000 (~435$)
8GB + 256GB = Rs.38,000 (~450$)
12GB + 256GB = Rs.40,000 (~480$)
In China, Neo 9 Pro is available with 12GB RAM in the base model at just 320$
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RedMagic DAO 150W GaN Charger with Transparent Design launched in Europe
RedMagic has introduced the REDMAGIC DAO 150W GaN Charger with Transparent Design, QC, PD and PPS support
Ports
DC:150W
2x USB-C: 140W
USB-A: 30W
The charger features an interactive LCD screen with dynamic charging animations for added appeal.
It includes US and EU plugs without the need for adapters.
The charger is detachable with foldable plug design
The charger incorporates innovative features such as a transparent window showcasing internal components, a cooling copper sheet, gold sinking technology, and laser engraving for an attractive appearance.
The charger supports Bluetooth connectivity via the βGoperβ app, enabling remote adjustment of RGB lights and real-time monitoring of the charging status for each port.
Priced at 199 Euros (~200$)
Follow @TechLeaksZOne
RedMagic has introduced the REDMAGIC DAO 150W GaN Charger with Transparent Design, QC, PD and PPS support
Ports
DC:150W
2x USB-C: 140W
USB-A: 30W
The charger features an interactive LCD screen with dynamic charging animations for added appeal.
It includes US and EU plugs without the need for adapters.
The charger is detachable with foldable plug design
The charger incorporates innovative features such as a transparent window showcasing internal components, a cooling copper sheet, gold sinking technology, and laser engraving for an attractive appearance.
The charger supports Bluetooth connectivity via the βGoperβ app, enabling remote adjustment of RGB lights and real-time monitoring of the charging status for each port.
Priced at 199 Euros (~200$)
Follow @TechLeaksZOne
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Nothing Phone 2a Official Press Renders Leaked!
Source
Although it seems like metal build quality, but phone 2a will come plastic frame only
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Source
Although it seems like metal build quality, but phone 2a will come plastic frame only
Follow @TechLeaksZone
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Xiaomi Pad 6S Pro launched in China
Specifications:
β’ 12.4-inch (3048x2032 px) 16:10 aspect ratio IPS LCD display
β’ 144Hz Variable Refresh Rate
β’ HDR 10; Dolby Vision
β’ 900nits peak brightness
β’ Gorilla Glass 5 protection
β’ Snapdragon 8 Gen 2 SoC
β’ LPDDR5X RAM with UFS 4.0 storage
β’ 50MP main (NO OIS) + 2MP useless dual rear camera
β’ 32MP front camera (OV32C)
β’ Dolby Atmos, 4 Speakers, 4 mics
β’ Wi-Fi 6; BT 5.3; USB-C 3.2 Gen 1
β’ 10,000mAh battery with 120W Fast charging
Colors: Black, Blue and Green
Accessories:
Smart touch Keyboard
Xiaomi Focus Stylus can be used as a virtual laser pointer in conference presentations.
Pricing:
β’ 8GB + 256GB = 3299 CNY (~460$)
β’ 12GB + 256GB = 3599 CNY (~500$)
β’ 12GB + 512GB = 3999 CNY (~555$)
β’ 16GB + 1TB = 4499 CNY (~625$)
Follow @TechLeaksZone
Specifications:
β’ 12.4-inch (3048x2032 px) 16:10 aspect ratio IPS LCD display
β’ 144Hz Variable Refresh Rate
β’ HDR 10; Dolby Vision
β’ 900nits peak brightness
β’ Gorilla Glass 5 protection
β’ Snapdragon 8 Gen 2 SoC
β’ LPDDR5X RAM with UFS 4.0 storage
β’ 50MP main (NO OIS) + 2MP useless dual rear camera
β’ 32MP front camera (OV32C)
β’ Dolby Atmos, 4 Speakers, 4 mics
β’ Wi-Fi 6; BT 5.3; USB-C 3.2 Gen 1
β’ 10,000mAh battery with 120W Fast charging
Colors: Black, Blue and Green
Accessories:
Smart touch Keyboard
Xiaomi Focus Stylus can be used as a virtual laser pointer in conference presentations.
Pricing:
β’ 8GB + 256GB = 3299 CNY (~460$)
β’ 12GB + 256GB = 3599 CNY (~500$)
β’ 12GB + 512GB = 3999 CNY (~555$)
β’ 16GB + 1TB = 4499 CNY (~625$)
Follow @TechLeaksZone
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Xiaomi 14 Ultra launched in China
Specs:
β’ 6.73" 2K-10bit TCL CSoT C8 LTPO OLED Display
β’ 120Hz refresh rate
β’ 3000nits peak
β’ HDR10+; Dolby Vision
β’ 1920Hz PWM Dimming
β’ Xiaomi Ceramic Glass protection
β’ Snapdragon 8 Gen 3 SoC
β’ LPDDR5X RAM; UFS 4.0 storage
β’ 4000mmΒ² cooling system
β’ 50MP main (Sony LYT-900; OIS)
β’ 50MP Ultra-Wide (IMX 858)
β’ f/1.63~f/4.0 Stepless Variable Aperture
β’ 50MP 3.2X Telephoto-Periscope (IMX 858, f/1.8; OIS)
β’ 50MP 5X Telephoto (IMX 858; f/2.5, OIS)
β’ Telephoto Macro
β’ LEICA SUMMILUX Lens
β’ 8K and 4K@ 60fps video
β’ 32MP front camera
β’ 5300mAh Battery; IP68 rated
β’ 90W wired + 80W wireless + 10W reverse
β’ In-display fingerprint; IR Blaster
β’ Hi-Res audio; Stereo speakers; Dolby Atmos
β’ IP68 rated; USB-C 3.2; Wi-Fi 7
β’ 2-way satellite communication
Colors: Blue (Ceramic), Black and White (Vegan leather)
Pricing
β’ 12GB+256GB= 6499 CNY (~905$)
β’ 16GB+512GB= 6999 CNY (~975$)
β’ 16GB+1TB= 7999 CNY (~1085$)
Titanium Edition:
β’ 16GB+1TB= 8799 CNY (~1223$)
Follow @TechLeaksZone
Specs:
β’ 6.73" 2K-10bit TCL CSoT C8 LTPO OLED Display
β’ 120Hz refresh rate
β’ 3000nits peak
β’ HDR10+; Dolby Vision
β’ 1920Hz PWM Dimming
β’ Xiaomi Ceramic Glass protection
β’ Snapdragon 8 Gen 3 SoC
β’ LPDDR5X RAM; UFS 4.0 storage
β’ 4000mmΒ² cooling system
β’ 50MP main (Sony LYT-900; OIS)
β’ 50MP Ultra-Wide (IMX 858)
β’ f/1.63~f/4.0 Stepless Variable Aperture
β’ 50MP 3.2X Telephoto-Periscope (IMX 858, f/1.8; OIS)
β’ 50MP 5X Telephoto (IMX 858; f/2.5, OIS)
β’ Telephoto Macro
β’ LEICA SUMMILUX Lens
β’ 8K and 4K@ 60fps video
β’ 32MP front camera
β’ 5300mAh Battery; IP68 rated
β’ 90W wired + 80W wireless + 10W reverse
β’ In-display fingerprint; IR Blaster
β’ Hi-Res audio; Stereo speakers; Dolby Atmos
β’ IP68 rated; USB-C 3.2; Wi-Fi 7
β’ 2-way satellite communication
Colors: Blue (Ceramic), Black and White (Vegan leather)
Pricing
β’ 12GB+256GB= 6499 CNY (~905$)
β’ 16GB+512GB= 6999 CNY (~975$)
β’ 16GB+1TB= 7999 CNY (~1085$)
Titanium Edition:
β’ 16GB+1TB= 8799 CNY (~1223$)
Follow @TechLeaksZone
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