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Michael Fritzell (Asian Century Stocks)
Jonathan Tepper’s new memoir “Shooting Up” just released. He was one of the co-founders of UK research firm Variant Perception. I’m looking forward to this one.

https://t.co/todHIsy92q https://t.co/21JgDQiCOr
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anon
I wish more smart people like Elon could just post a link to their Grok/Gemini/ChatGPT conversations. It almost reads like Montaign's Essays. Really interesting.

The Meaning of Life https://t.co/L9FaXIwU50
- Elon Musk
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Moon Dev
Most people using openclaw are trying to save money in the wrong place

You need to pay up for a mac and save money here instead https://t.co/mUU9u46M7w
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anon
strange pattern u see recently is jp companies identifying themselves as a 'rollup'. maybe that's a neat way of evading shareholder pressure.
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Illiquid
Congrats to nuclear basket bros. https://t.co/sECtjtUduQ

Japan's new semicon fabs are going to consume a surprising amount of energy. Japan's official energy plan targets nuclear power to provide 20-22% of its electricity by 2030, up from around 8% today. Nuclear restart basket anyone? Can start with Okano, which provides valves and maintenance for domestic nuclear power generation. $6492
- Illiquid
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God of Prompt
RT @godofprompt: Perplexity is terrifyingly good at competitive intelligence.

If you use these 10 prompts, you’ll see why:

(Bookmark this thread for later) https://t.co/iEiiYxTKyp
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Jukan
NVIDIA's AI Accelerator 'Tiering' Coming... Focus on HBM4 Processing Speed

Big tech companies including NVIDIA are expected to devise a 'high-performance-centric' memory supply strategy to maximize next-generation artificial intelligence (AI) accelerator performance. In this scenario, Samsung Electronics—which holds a technical edge in specifications within the 6th-generation High Bandwidth Memory (HBM4) market—stands to benefit.

According to industry sources on the 19th, NVIDIA is reviewing a 'Dual Bin' structure to simultaneously secure HBM4 supply stability and performance. Dual binning is a strategy where chips based on the same design are supplied in top-tier and second-tier grades based on speed, power efficiency, and other criteria.

Big tech companies are expected to apply 'top bin' chips rated at 11.7 Gbps or above to their flagship products, while using 'second bin' chips in the 10 Gbps range for complementary products in parallel.

In NVIDIA's case, rather than expanding lower-spec volume, the company is likely to focus on high-performance bins for its flagship products—driven by the symbolic importance of achieving peak AI accelerator performance.

Big tech firms are grappling with memory bottlenecks as they develop next-generation AI accelerators. While compute units (GPUs) operate at high speeds, memory transfer speeds cannot keep pace, degrading overall system efficiency.

Samsung Electronics' HBM4 operates at 11.7 Gbps on paper. It utilizes 1c (6th-generation 10nm-class) DRAM and a 4nm-based base die. This exceeds the JEDEC standard of 8 Gbps by approximately 46%. It represents a 1.22x improvement over HBM3E (9.6 Gbps), with prospects of achieving up to 13 Gbps going forward.

An industry official explained, "Rather than simply focusing on volume procurement, NVIDIA is prioritizing accelerator performance maximization," adding that "Samsung Electronics' influence will strengthen as it can stably produce top-bin parts."
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Michael Fritzell (Asian Century Stocks)
First Pacific still trades at P/E 5x…

Four stages of Indomie Goreng https://t.co/xwEnYulfX7
- FRValue
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Michael Fritzell (Asian Century Stocks)
Just putting this out there... https://t.co/mVOTPRkDfk
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