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Jukan
Suddenly a bunch of people are sliding into my DMs asking about this, but honestly, there’s no need to worry too much.
HP and Dell have already repeatedly told their sell-side partners in meetings that they’re going to use Chinese-made memory in their “consumer-grade” products. This isn’t some secret—anyone who’s supposed to know already knows.
As long as it doesn’t go into AI servers, it’s perfectly fine.
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Suddenly a bunch of people are sliding into my DMs asking about this, but honestly, there’s no need to worry too much.
HP and Dell have already repeatedly told their sell-side partners in meetings that they’re going to use Chinese-made memory in their “consumer-grade” products. This isn’t some secret—anyone who’s supposed to know already knows.
As long as it doesn’t go into AI servers, it’s perfectly fine.
tweet
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Michael Fritzell (Asian Century Stocks)
I like this one... no idea why they get all the contracts, but they'll benefit from the Long Thanh Airport opening in 2026. Phillip Securities offers access to Vietnam.
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I like this one... no idea why they get all the contracts, but they'll benefit from the Long Thanh Airport opening in 2026. Phillip Securities offers access to Vietnam.
We initiate coverage of Taseco Air Services (AST VN), a non-aviation services provider (pureplay on tourism in Vietnam) trading at <11x PE, with a 48% ROCE and >6% dividend yield. https://t.co/KpaRdgbQUn tweet
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Jukan
"On top of that, we know that the vast majority of the new capacity will be prioritized to Chinese companies like Huawei and Lenovo, which would leave not much of the capacity for the rest of us."
Even if Dell and HP wanted to use Chinese-made memory, I’m skeptical they’d be able to secure enough supply.
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"On top of that, we know that the vast majority of the new capacity will be prioritized to Chinese companies like Huawei and Lenovo, which would leave not much of the capacity for the rest of us."
Even if Dell and HP wanted to use Chinese-made memory, I’m skeptical they’d be able to secure enough supply.
Suddenly a bunch of people are sliding into my DMs asking about this, but honestly, there’s no need to worry too much.
HP and Dell have already repeatedly told their sell-side partners in meetings that they’re going to use Chinese-made memory in their “consumer-grade” products. This isn’t some secret—anyone who’s supposed to know already knows.
As long as it doesn’t go into AI servers, it’s perfectly fine. tweet
Michael Fritzell (Asian Century Stocks)
How gen AI has affected my little publication:
- Better lead generation by asking LLMs about insider txn and related catalysts
- Better understanding of the firm accounts and local news stories thru NotebookLM
- Close to zero spelling mistakes via Grammarly
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How gen AI has affected my little publication:
- Better lead generation by asking LLMs about insider txn and related catalysts
- Better understanding of the firm accounts and local news stories thru NotebookLM
- Close to zero spelling mistakes via Grammarly
tweet
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Michael Fritzell (Asian Century Stocks)
RT @TweetThreatNews: Nearly 700,000 Substack user records were scraped in late 2025, exposing names, emails, phones, user and Stripe IDs, profile pics, bios, account dates, and social handles. The breach was quickly patched. #DataBreach #SubstackLeak #USA
https://t.co/ElcGxjObMF
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RT @TweetThreatNews: Nearly 700,000 Substack user records were scraped in late 2025, exposing names, emails, phones, user and Stripe IDs, profile pics, bios, account dates, and social handles. The breach was quickly patched. #DataBreach #SubstackLeak #USA
https://t.co/ElcGxjObMF
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Offshore
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Jukan
RT @kwharrison13: The annual Contrary Research Tech Trends Report is here.
350+ slides on everything from computational intelligence to lunar bases to breakthroughs in biologics to AVs revolutionizing land use to the loneliness epidemic and so much more.
Full report in reply.
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RT @kwharrison13: The annual Contrary Research Tech Trends Report is here.
350+ slides on everything from computational intelligence to lunar bases to breakthroughs in biologics to AVs revolutionizing land use to the loneliness epidemic and so much more.
Full report in reply.
tweet
Offshore
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Jukan
[Exclusive] Samsung to Expand DRAM Capacity for HBM4 by 120,000 Wafers per Month
Samsung Electronics is embarking on an initiative to increase its new DRAM production capacity by nearly 20% this year, centered around its Pyeongtaek Plant 4 (P4). The core of this expansion is to significantly boost the production of 6th-generation 10nm-class (1c) DRAM, which serves as the primary material for 6th-generation High Bandwidth Memory (HBM4). This move is interpreted as a strategic plan for aggressive facility investment, driven by a sharp recovery in the company's HBM4 technical competitiveness and the ever-increasing demand for DRAM from Artificial Intelligence (AI) customers.
According to industry sources on the 5th, Samsung Electronics has established a strategy to build a new DRAM production line at 'P4' in Pyeongtaek, Gyeonggi Province—the company's latest semiconductor factory—capable of producing 100,000 to 120,000 wafers per month by the first quarter of next year. This line will specifically house the 1c DRAM production infrastructure used for HBM4.
HBM is a type of memory created by vertically stacking multiple DRAMs. It is faster and has a larger capacity than single DRAM units, making it a highly sought-after product in the AI industry, which requires complex computations.
HBM4 is the latest HBM product that Samsung Electronics will supply to AI semiconductor companies such as NVIDIA and AMD starting this year. Samsung produces HBM4 by vertically stacking 12 units of 1c DRAM, the most advanced product currently available.
Industry experts evaluate Samsung’s establishment of a new 1c DRAM line for HBM4 as a substantial investment. To date, Samsung Electronics possesses lines capable of producing 660,000 DRAM wafers per month. Adding up to 120,000 wafers of new capacity would mean a maximum 18% increase in DRAM production capability within a single year.
The production ratio of 1c DRAM for HBM4 is also expected to rise. Samsung Electronics is known to have established a production line for 60,000 to 70,000 1c DRAM wafers monthly as of last year. If the lines are completed as planned, the capacity for 1c DRAM for HBM4 will reach nearly 200,000 wafers per month, meaning HBM4-specific DRAM alone will account for 25% of the total production process.
Furthermore, the 4nm process line at S5, the Pyeongtaek foundry plant that manufactures HBM4 base dies, is reportedly operating in "full-throttle" mode. Construction on the exterior of 'P5,' currently being built in Pyeongtaek, is also moving busily to align with the timing for semiconductor manufacturing equipment delivery as early as the first quarter of next year.
The company is also reportedly considering expanding the production of general-purpose 1c DRAM used in mobile devices and home appliances. This involves a large-scale process transition to 1c DRAM, primarily at Hwaseong Line 17, where previous generation processes were located.
Samsung Electronics’ decision to significantly strengthen its 1c DRAM production capacity this year stems from growing confidence in its latest technology and the arrival of a memory "super cycle" driven by the expansion of the AI market.
The atmosphere within Samsung Electronics has recently seen a surge in technical confidence. Until last year, the company struggled significantly with the manufacturing of HBM4 and 1c DRAM. Consequently, Vice Chairman Jun Young-hyun, who was appointed as the new head of the Device Solutions (DS) division in 2024, decided on a redesign of the 1c DRAM. This strategy proved successful, leading to a rapid recovery in technology since the first half of last year.
In the HBM4 sector specifically, Samsung recently passed the "qual test" (qualification test) for NVIDIA—the world's leading AI semiconductor company—beating its competitors to become the first to do so, and is now ahead of mass production shipments. Faced with a situation where HBM4 production must be scaled up rapidly, the company has entered the stage of bu[...]
[Exclusive] Samsung to Expand DRAM Capacity for HBM4 by 120,000 Wafers per Month
Samsung Electronics is embarking on an initiative to increase its new DRAM production capacity by nearly 20% this year, centered around its Pyeongtaek Plant 4 (P4). The core of this expansion is to significantly boost the production of 6th-generation 10nm-class (1c) DRAM, which serves as the primary material for 6th-generation High Bandwidth Memory (HBM4). This move is interpreted as a strategic plan for aggressive facility investment, driven by a sharp recovery in the company's HBM4 technical competitiveness and the ever-increasing demand for DRAM from Artificial Intelligence (AI) customers.
According to industry sources on the 5th, Samsung Electronics has established a strategy to build a new DRAM production line at 'P4' in Pyeongtaek, Gyeonggi Province—the company's latest semiconductor factory—capable of producing 100,000 to 120,000 wafers per month by the first quarter of next year. This line will specifically house the 1c DRAM production infrastructure used for HBM4.
HBM is a type of memory created by vertically stacking multiple DRAMs. It is faster and has a larger capacity than single DRAM units, making it a highly sought-after product in the AI industry, which requires complex computations.
HBM4 is the latest HBM product that Samsung Electronics will supply to AI semiconductor companies such as NVIDIA and AMD starting this year. Samsung produces HBM4 by vertically stacking 12 units of 1c DRAM, the most advanced product currently available.
Industry experts evaluate Samsung’s establishment of a new 1c DRAM line for HBM4 as a substantial investment. To date, Samsung Electronics possesses lines capable of producing 660,000 DRAM wafers per month. Adding up to 120,000 wafers of new capacity would mean a maximum 18% increase in DRAM production capability within a single year.
The production ratio of 1c DRAM for HBM4 is also expected to rise. Samsung Electronics is known to have established a production line for 60,000 to 70,000 1c DRAM wafers monthly as of last year. If the lines are completed as planned, the capacity for 1c DRAM for HBM4 will reach nearly 200,000 wafers per month, meaning HBM4-specific DRAM alone will account for 25% of the total production process.
Furthermore, the 4nm process line at S5, the Pyeongtaek foundry plant that manufactures HBM4 base dies, is reportedly operating in "full-throttle" mode. Construction on the exterior of 'P5,' currently being built in Pyeongtaek, is also moving busily to align with the timing for semiconductor manufacturing equipment delivery as early as the first quarter of next year.
The company is also reportedly considering expanding the production of general-purpose 1c DRAM used in mobile devices and home appliances. This involves a large-scale process transition to 1c DRAM, primarily at Hwaseong Line 17, where previous generation processes were located.
Samsung Electronics’ decision to significantly strengthen its 1c DRAM production capacity this year stems from growing confidence in its latest technology and the arrival of a memory "super cycle" driven by the expansion of the AI market.
The atmosphere within Samsung Electronics has recently seen a surge in technical confidence. Until last year, the company struggled significantly with the manufacturing of HBM4 and 1c DRAM. Consequently, Vice Chairman Jun Young-hyun, who was appointed as the new head of the Device Solutions (DS) division in 2024, decided on a redesign of the 1c DRAM. This strategy proved successful, leading to a rapid recovery in technology since the first half of last year.
In the HBM4 sector specifically, Samsung recently passed the "qual test" (qualification test) for NVIDIA—the world's leading AI semiconductor company—beating its competitors to become the first to do so, and is now ahead of mass production shipments. Faced with a situation where HBM4 production must be scaled up rapidly, the company has entered the stage of bu[...]
Offshore
Jukan [Exclusive] Samsung to Expand DRAM Capacity for HBM4 by 120,000 Wafers per Month Samsung Electronics is embarking on an initiative to increase its new DRAM production capacity by nearly 20% this year, centered around its Pyeongtaek Plant 4 (P4). The…
ilding new lines centered on P4, its most advanced facility.
Additionally, the company must increase production capacity to respond to tightening memory supply chains caused by the AI boom. According to market research firm Counterpoint Research, the price of 64GB DDR5 DRAM for servers rose by 98% in the first quarter of this year compared to the fourth quarter of last year, marking a significant price hike.
An industry official stated, "Samsung Electronics possesses abundant production capacity and capital, allowing it to respond relatively flexibly to surging demand. As technological recovery and supply shortages coincide this year, the company is expected to proceed with facility investments quite aggressively."
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Additionally, the company must increase production capacity to respond to tightening memory supply chains caused by the AI boom. According to market research firm Counterpoint Research, the price of 64GB DDR5 DRAM for servers rose by 98% in the first quarter of this year compared to the fourth quarter of last year, marking a significant price hike.
An industry official stated, "Samsung Electronics possesses abundant production capacity and capital, allowing it to respond relatively flexibly to surging demand. As technological recovery and supply shortages coincide this year, the company is expected to proceed with facility investments quite aggressively."
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