HPCwire (Twitter)
The future of chips is here with UCIe 2.0, promising up to 75x more bandwidth and unmatched power efficiency. This new interconnect spec paves the way for next-gen #3Dchip designs. Discover how this breakthrough will shape the future of #computing. ow.ly/C6UV50T28nP
The future of chips is here with UCIe 2.0, promising up to 75x more bandwidth and unmatched power efficiency. This new interconnect spec paves the way for next-gen #3Dchip designs. Discover how this breakthrough will shape the future of #computing. ow.ly/C6UV50T28nP
HPC Guru (Twitter)
RT @Livermore_Comp: Our ATO (some pictured here, including CTO Bronis de Supinski) heads up LC's leading-edge #HPC efforts: Paving the #exascale path w/ El Capitan, forging strong vendor partnerships, & exploring new technologies are all in a day's work.
http://computing.llnl.gov/livermore-computing
#computing
RT @Livermore_Comp: Our ATO (some pictured here, including CTO Bronis de Supinski) heads up LC's leading-edge #HPC efforts: Paving the #exascale path w/ El Capitan, forging strong vendor partnerships, & exploring new technologies are all in a day's work.
http://computing.llnl.gov/livermore-computing
#computing