When it comes to a lot of high performance computing systems we have seen over the decades, we are fond of saying that the hardware is the easy part. This is not universally true, and it certainly has not been true for the “Aurora” supercomputer at Argonne…

SHANGHAI, June 28, 2023 — SEMICON China 2023, the world’s largest semiconductor conference and exhibition, opens tomorrow at the Shanghai New International Expo Centre to highlight critical industry themes including […]

​June 28, 2023 — By launching the NextGen project, CEA aims to develop new generations of FD-SOI chips with better energy efficiency. It will ensure the capacity to engineer the […]

June 28, 2023 — The Department of Energy (DOE) this week signed an implementation agreement with Sweden to further promote and facilitate basic science research in energy and related fields. […]

NORWOOD, Mass., June 26, 2023 — SourceCode, an IT systems company for AI infrastructure, announced it has agreed to acquire UK-EU-based Boston [...]

June 28, 2023 — As part of a collaboration with Intel and Dell Technologies, the United Kingdom Atomic Energy Authority (UKAEA) and the Cambridge Open Zettascale Lab plan to build […]

In the rapidly evolving landscape of Artificial Intelligence (AI) and hardware, open-source principles have become a key driver of innovation. This talk will explore the transformative power of open source in AI model development, deployment, and hardware…

SANTA CLARA, CA – June 28, 2023 – Photonic fabric company Celestial AI today announced it has raised $100 million in Series B funding led by IAG Capital [...]

AMD has maintained steady progress in the Field Programmable Gate Array (FPGA) market, gaining market share where Intel has faltered. While Intel is planning a big FPGA splash this year, […]

SAN JOSE, Calif., June 28, 2023 — Cadence Design Systems, Inc. today announced that it has delivered a complete, certified backside implementation flow to support Samsung Foundry’s SF2 process node. […]

June 28, 2023 — Tohoku University and NEC Corporation have started joint research on computer systems using an 8-qubit quantum annealing machine developed by NEC and Japan’s National Institute of Advanced […]

June 28, 2023 — Since its inception in September 2021, the National Science Data Fabric (NSDF) Initiative—a pilot project that democratizes data-driven scientific discovery across an open network of institutions […]

SUNNYVALE, Calif., June 28, 2023 — Synopsys, Inc. and Samsung Foundry are deepening their collaboration to help chipmakers accelerate the design of 2.5D and 3D multi-die systems on Samsung’s most […]

Intel Looks to Regain Semiconductor Leadership

PITTSBURGH, June 28, 2023 — Following close collaboration with Samsung Foundry, Ansys has achieved certification of Ansys RedHawk-SC and Ansys Totem power integrity signoff solutions for Samsung’s latest 2nm silicon […]

PITTSBURGH, June 28, 2023 — Ansys has announced that Samsung Foundry has certified Ansys’ RedHawk power integrity and thermal verification platform for Samsung’s family of heterogeneous multi-die packaging technologies. Samsung’s […]

June 28, 2023 — Leading users and industry-standard benchmarks agree: NVIDIA H100 Tensor Core GPUs deliver the best AI performance, especially on the large language models (LLMs) powering generative AI. H100 GPUs […]