🪟 Windows 95 running on ESP32 (Tiny386 Emulator)

Tiny386 is a lightweight x86 PC emulator that transforms the low-cost 🇨🇳 ESP32-S3 microcontroller into a fully functional retro desktop computer capable of running classic operating systems like Microsoft Windows 95 and various 16- and 32-bit software. The project showcases the surprising power of modern microcontrollers when paired with efficient emulation techniques.

The features of the project:
➡️Written in C99 with only around 6,000 lines of code for the CPU emulator.
➡️Emulates an Intel i386 CPU, supporting most 16/32-bit software with added 486/586 instructions for newer OS compatibility.
➡️Runs directly on the ESP32-S3 (dual 240 MHz cores) with optional external PSRAM for memory expansion.
➡️Features include VGA graphics, Ethernet emulation, and multiple sound options (PC Speaker, AdLib OPL2, Sound Blaster 16).
➡️Incorporates SeaBIOS firmware for BIOS/VGABIOS functionality, with the option to boot Linux kernels directly.
➡️Fully open-source under the BSD 3-Clause license, with browser-based and hardware demos available.

Tiny386 impressively demonstrates how modern embedded hardware can recreate classic computing environments once reserved for full-sized PCs.

More information:
🔗 The main article
😹 The GitHub repository

#projects #esp32 #windows95 #emulator

💍 Open Ring - Open-Source Smart Ring

This series follows the development of Open Ring — an open-source Smart Ring engineered to pack full wireless connectivity, sensing, haptics, and charging into a tiny, finger-sized wearable. Parts 1 and 2 uncover both the early research phase and the deep hardware design decisions that make such a compact device possible.

Key features of the project:
➡️Provides market research, product teardowns, and early prototyping insights
➡️Rigid-flex PCB design enabling ultra-thin construction and dense component placement
➡️Detailed exploration of BLE SoC selection, antenna engineering, and RF constraints
➡️Power management, curved batteries, and a fully custom wireless charging system
➡️Scalable design for multiple ring sizes with reusable PCB sections
➡️Mutual-capacitance touch sensing paired with dual-MCU control for gesture input
➡️Miniaturized haptic feedback achieved through tiny motors boosted by a high-capacity capacitor bank

With the first two parts laying out both the research journey and the hardware engineering behind Open Ring, the series gives a clear and honest look at what it takes to turn a small idea into a real piece of wearable tech. The project has its own 😹 GitHub repository. The project is still in progress, and the upcoming Part 3 will dive into the firmware that brings all of this hardware to life.

More information:
🔗 Part 1: Research and Prototype
🔗 Part 2: Hardware Design

#projects #articles #smart_ring

💻 The smallest ESP32 board (Open-Source)

The f32 is an ultra-miniature open-source ESP32-C3 development board measuring just slightly larger than a USB-C connector. It integrates an ESP32-C3FH4 MCU with USB-C power and programming in an extremely compact form factor.

Features of the project:
➡️ESP32-C3FH4 RISC-V SoC with 400 KB SRAM and 4 MB flash
➡️2.4 GHz Wi-Fi 4 and Bluetooth 5.0
➡️USB-C port for power/programming
➡️Single GPIO connected to an onboard LED
➡️Ceramic antenna with tested wireless range up to ~38 m
➡️Open-source PCB design using very small components

This board is ideal for advanced makers who need Wi-Fi connectivity in the smallest possible footprint. Its minimal I/O and challenging assembly make it best suited for experimental ultra-compact devices rather than general-purpose IoT development.

⛓ More information...

#projects #esp32

📊 Semiconductor Sovereignty Policies (2025 Report)

Governments are accelerating local semiconductor manufacturing to reduce foreign dependency and geopolitical risk, including lower-power IoT chips. Policies now treat these technologies as critical digital infrastructure, expanding export controls to cover microcontrollers, connectivity, sensors, and security chips. Notable examples include the following:

➡️US – The CHIPS and Science Act allocated $52.7 billion to boost domestic manufacturing and R&D. Further, the government has expanded funding to semiconductor production companies like Intel, TSMC, and Samsung.

➡️China – China has countered the US’s actions with a $47.5 billion “Big Fund” to boost domestic chipmaking and close its technology gap by 2030.

➡️Japan – The government of Japan has committed approximately $65 billion by 2030 to expand its semiconductor and AI sectors, supporting domestic fabs and R&D partnerships.

➡️South Korea – Republic of Korea officials announced a $19 billion support package in 2024 to strengthen its chip supply chain and SME competitiveness.

➡️EU – Leading national efforts include Italy’s €10 billion investment to become one of the largest microelectronics producers in Europe and the Netherlands’ €2.5 billion Brainport Eindhoven initiative, which aims to enhance collaboration between businesses, academia, and governments for technological development, including semiconductors.

Semiconductor localization is becoming a strategic priority as countries aim for more resilient, self-sufficient IoT and tech supply chains. These investments signal a long-term shift toward regional chip ecosystems and reduced foreign dependency.

⛓ More information...

#articles

📺 Why Fighter Jets Ban 90% of C++ Features

The video’s story highlights how reliability comes from strict control over language features rather than from the language’s full power. The F-35’s C++ subset demonstrates how banning exceptions, implicit conversions, and unpredictable allocation paths leads to code that behaves the same way every time, under every condition.

⛓ https://youtu.be/Gv4sDL9Ljww

#video #programming

🌊 Waveshare has released ESP32-C6-Touch-AMOLED-1.8

The Waveshare ESP32-C6-Touch-AMOLED-1.8 is a compact development board built around 🇨🇳 Espressif’s ESP32-C6 wireless SoC. It combines modern wireless connectivity with a high-quality AMOLED touch display and a rich set of onboard peripherals, making it well suited for interactive IoT and HMI-focused projects.

Key features of the board:
➡️ESP32-C6 SoC with single-core RISC-V CPU, Wi-Fi 6, Bluetooth LE, Zigbee, and Thread
➡️1.8-inch capacitive AMOLED display (368 × 448, 16.7M colors)
➡️Built-in microphone, speaker, and low-power audio codec
➡️6-axis IMU, real-time clock with backup support, and microSD card slot
➡️USB-C for power and programming, Li-ion battery support with PMIC

Overall, this development board stands out as a highly integrated, display-centric ESP32-C6 platform. It would be especially interesting for developers working on smart home panels, wearable or handheld IoT devices and portable dashboards.

⛓ More information...

#boards #esp32

🤖 Sub-$200 Lidar Could Reshuffle Auto Sensor Economics

MicroVision, a Redmond, Washington–based solid-state sensor company, has introduced a new automotive lidar it says can reach production pricing below $200 per unit, with a long-term goal of $100. The move aims to make lidar economically viable for mainstream advanced driver-assistance systems rather than limiting it to premium autonomous programs.

Key features and highlights:
➡️Movia S solid-state phased-array architecture
➡️180-degree horizontal field of view
➡️Detects objects up to 200 meters
➡️Designed for high-volume manufacturing
➡️Multi-sensor vehicle deployment required
➡️Competes with Hesai, Luminar

The technology is important because it moves lidar from an experimental or premium feature toward a scalable safety component for everyday vehicles. For automakers, suppliers, and investors, this development signals a transition from performance-driven innovation to economically sustainable deployment—one that could soon see adoption beyond the automotive sector.

⛓ More information...

#news

🖥 ASML unveils EUV light source advance that could yield 50% more chips by 2030

ASML has unveiled a breakthrough in its extreme ultraviolet (EUV) lithography technology, revealing a new light source capable of reaching 1,000 watts of power. The advance could allow chipmakers to produce up to 50% more chips by 2030, strengthening ASML’s lead as global rivals in the United States and China attempt to develop competing systems.

Key features and highlights:
➡️EUV power increased from 600W to 1,000W
➡️Up to 50% higher chip output
➡️Target of 330 wafers per hour
➡️New dual-laser plasma shaping method

In conclusion, this development is significant because EUV machines are essential for manufacturing the world’s most advanced semiconductors. By increasing output and lowering per-chip production costs, ASML reinforces its technological dominance at a time of geopolitical competition and export restrictions.

⛓ More information...

#news