Kickstart Your Career in VLSI! Join Us as a DesignVerificationEngineer FresherRole 🌟
Are you a passionate ECE/EEE graduate looking to launch your career in the semiconductor industry? We are hiring freshers for DesignVerification roles!
🔍 What We’re Looking For:
✅ B.Tech/M.Tech B.Tech/M.Tech in ECE, EEE or related fields
✅ Basic knowledge of Verilog/SystemVerilog
✅ Passion to learn UVM methodology and VLSI verification concepts
✅ Good problem-solving and debugging skills
🚀 What We Offer:
✨ Opportunity to work on cutting-edge SoC/ASIC projects
✨ Hands-on training & mentorship from industry experts
✨ Collaborative and growth-oriented work culture
✨ Career path into leading product and service companies
📍 Location: Bangalore
📨 How to Apply:
Send your updated resume to prisha@siplont.com
Subject: Fresher – Design Verification Application
Are you a passionate ECE/EEE graduate looking to launch your career in the semiconductor industry? We are hiring freshers for DesignVerification roles!
🔍 What We’re Looking For:
✅ B.Tech/M.Tech B.Tech/M.Tech in ECE, EEE or related fields
✅ Basic knowledge of Verilog/SystemVerilog
✅ Passion to learn UVM methodology and VLSI verification concepts
✅ Good problem-solving and debugging skills
🚀 What We Offer:
✨ Opportunity to work on cutting-edge SoC/ASIC projects
✨ Hands-on training & mentorship from industry experts
✨ Collaborative and growth-oriented work culture
✨ Career path into leading product and service companies
📍 Location: Bangalore
📨 How to Apply:
Send your updated resume to prisha@siplont.com
Subject: Fresher – Design Verification Application
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Interex is Hiring!
We are looking for enthusiastic graduates with 1 to 2 years of experience for Recruitment and Presales roles.
Preferred Background:
– Experience in Semiconductor or Embedded domains
– Strong communication and coordination skills
– Immediate joiners preferred
If you or someone you know fits the bill, please send your resume to naveen.yk@interexsemi.com
We are looking for enthusiastic graduates with 1 to 2 years of experience for Recruitment and Presales roles.
Preferred Background:
– Experience in Semiconductor or Embedded domains
– Strong communication and coordination skills
– Immediate joiners preferred
If you or someone you know fits the bill, please send your resume to naveen.yk@interexsemi.com
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Electronics Geek | Electrical and Electronics Job Updates / VLSI / embedded pinned «Exciting Job Opportunities for Freshers | Apply Now https://youtu.be/m0iMrW3o3bU»
"Silicon to Semiconductor Package":
Wafer-Fab:
The process starts with the fabrication of silicon wafers.
This involves creating integrated circuits on a silicon substrate.
Circuit Design:
Circuit schematics and layouts are designed using CAD tools.
This stage defines how the chip will function.
Wafer Sort:
Each die on the wafer is electrically tested.
Defective dies are identified and marked.
Die Prep:
Functional dies are cut from the wafer (dicing).
These dies are then prepared for packaging.
Wafer Level & Package Assembly:
Dies are attached to a substrate.
Wire bonding or flip-chip methods are used to connect the die to the package.
Uses substrates and other assembly materials.
Test:
Packaged chips are tested again for functionality.
Ensures quality and performance.
Finish:
Final inspection and quality assurance.
Chips may be labeled and prepared for shipping.
Board Assembly:
Finished chips are mounted onto printed circuit boards (PCBs).
This step integrates the chip into electronic systems
Wafer-Fab:
The process starts with the fabrication of silicon wafers.
This involves creating integrated circuits on a silicon substrate.
Circuit Design:
Circuit schematics and layouts are designed using CAD tools.
This stage defines how the chip will function.
Wafer Sort:
Each die on the wafer is electrically tested.
Defective dies are identified and marked.
Die Prep:
Functional dies are cut from the wafer (dicing).
These dies are then prepared for packaging.
Wafer Level & Package Assembly:
Dies are attached to a substrate.
Wire bonding or flip-chip methods are used to connect the die to the package.
Uses substrates and other assembly materials.
Test:
Packaged chips are tested again for functionality.
Ensures quality and performance.
Finish:
Final inspection and quality assurance.
Chips may be labeled and prepared for shipping.
Board Assembly:
Finished chips are mounted onto printed circuit boards (PCBs).
This step integrates the chip into electronic systems
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