AI is becoming an essential tool in many fields, and I strongly recommend you start exploring how it can be applied to your work. Learning and implementing AI can save time, improve accuracy, and boost productivity. Let’s take the initiative to stay ahead in our respective fields!
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Kickstart Your Career in VLSI! Join Us as a DesignVerificationEngineer FresherRole 🌟
Are you a passionate ECE/EEE graduate looking to launch your career in the semiconductor industry? We are hiring freshers for DesignVerification roles!
🔍 What We’re Looking For:
✅ B.Tech/M.Tech B.Tech/M.Tech in ECE, EEE or related fields
✅ Basic knowledge of Verilog/SystemVerilog
✅ Passion to learn UVM methodology and VLSI verification concepts
✅ Good problem-solving and debugging skills
🚀 What We Offer:
✨ Opportunity to work on cutting-edge SoC/ASIC projects
✨ Hands-on training & mentorship from industry experts
✨ Collaborative and growth-oriented work culture
✨ Career path into leading product and service companies
📍 Location: Bangalore
📨 How to Apply:
Send your updated resume to prisha@siplont.com
Subject: Fresher – Design Verification Application
Are you a passionate ECE/EEE graduate looking to launch your career in the semiconductor industry? We are hiring freshers for DesignVerification roles!
🔍 What We’re Looking For:
✅ B.Tech/M.Tech B.Tech/M.Tech in ECE, EEE or related fields
✅ Basic knowledge of Verilog/SystemVerilog
✅ Passion to learn UVM methodology and VLSI verification concepts
✅ Good problem-solving and debugging skills
🚀 What We Offer:
✨ Opportunity to work on cutting-edge SoC/ASIC projects
✨ Hands-on training & mentorship from industry experts
✨ Collaborative and growth-oriented work culture
✨ Career path into leading product and service companies
📍 Location: Bangalore
📨 How to Apply:
Send your updated resume to prisha@siplont.com
Subject: Fresher – Design Verification Application
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Interex is Hiring!
We are looking for enthusiastic graduates with 1 to 2 years of experience for Recruitment and Presales roles.
Preferred Background:
– Experience in Semiconductor or Embedded domains
– Strong communication and coordination skills
– Immediate joiners preferred
If you or someone you know fits the bill, please send your resume to naveen.yk@interexsemi.com
We are looking for enthusiastic graduates with 1 to 2 years of experience for Recruitment and Presales roles.
Preferred Background:
– Experience in Semiconductor or Embedded domains
– Strong communication and coordination skills
– Immediate joiners preferred
If you or someone you know fits the bill, please send your resume to naveen.yk@interexsemi.com
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Electronics Geek | Electrical and Electronics Job Updates / VLSI / embedded pinned «Exciting Job Opportunities for Freshers | Apply Now https://youtu.be/m0iMrW3o3bU»
"Silicon to Semiconductor Package":
Wafer-Fab:
The process starts with the fabrication of silicon wafers.
This involves creating integrated circuits on a silicon substrate.
Circuit Design:
Circuit schematics and layouts are designed using CAD tools.
This stage defines how the chip will function.
Wafer Sort:
Each die on the wafer is electrically tested.
Defective dies are identified and marked.
Die Prep:
Functional dies are cut from the wafer (dicing).
These dies are then prepared for packaging.
Wafer Level & Package Assembly:
Dies are attached to a substrate.
Wire bonding or flip-chip methods are used to connect the die to the package.
Uses substrates and other assembly materials.
Test:
Packaged chips are tested again for functionality.
Ensures quality and performance.
Finish:
Final inspection and quality assurance.
Chips may be labeled and prepared for shipping.
Board Assembly:
Finished chips are mounted onto printed circuit boards (PCBs).
This step integrates the chip into electronic systems
Wafer-Fab:
The process starts with the fabrication of silicon wafers.
This involves creating integrated circuits on a silicon substrate.
Circuit Design:
Circuit schematics and layouts are designed using CAD tools.
This stage defines how the chip will function.
Wafer Sort:
Each die on the wafer is electrically tested.
Defective dies are identified and marked.
Die Prep:
Functional dies are cut from the wafer (dicing).
These dies are then prepared for packaging.
Wafer Level & Package Assembly:
Dies are attached to a substrate.
Wire bonding or flip-chip methods are used to connect the die to the package.
Uses substrates and other assembly materials.
Test:
Packaged chips are tested again for functionality.
Ensures quality and performance.
Finish:
Final inspection and quality assurance.
Chips may be labeled and prepared for shipping.
Board Assembly:
Finished chips are mounted onto printed circuit boards (PCBs).
This step integrates the chip into electronic systems
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