[DB금융투자 반도체 서승연]
5월 한국 반도체 수출 데이터 업데이트 드립니다.
업무에 도움이 되시길 바랍니다. 감사합니다.
>> 5월 한국 반도체 수출
■ 전자집적회로
- 수출액: $98.2억(+14% MoM, +47% YoY, +14% QoQ)
- 수출물량: +3% MoM, -1% YoY, +8% QoQ
- 수출단가: +10% MoM, +49% YoY, +6% QoQ
■ DRAM
- 수출액: $17.7억(+11% MoM, +48% YoY, +18% QoQ)
- 수출물량: +8% MoM, -27% YoY, -2% QoQ
- 수출단가: +3% MoM, +104% YoY, +20% QoQ
■ DRAM 모듈
- 수출액: $11.5억(+24% MoM, +195% YoY, +27% QoQ)
- 수출물량: +13% MoM, +75% YoY, +7% QoQ
- 수출단가: +10% MoM, +69% YoY, +19% QoQ
■ NAND
- 수출액: $6.9억(+11% MoM, +85% YoY, -23% QoQ)
- 수출물량: -2% MoM, +8% YoY, -25% QoQ
- 수출단가: +13% MoM, +71% YoY, +3% QoQ
■ SSD
- 수출액: $8.5억(+42% MoM, +60% YoY, +90% QoQ)
- 수출물량: +19% MoM, -14% YoY, +41% QoQ
- 수출단가: +19% MoM, +86% YoY, +34% QoQ
■ MCP
- 수출액: $27.0억(+25% MoM, +112% YoY, +17% QoQ)
- 수출물량: -3% MoM, -7% YoY, 0% QoQ
- 수출단가: +28% MoM, +128% YoY, +17% QoQ
주: 수출단가=수출액/수출물량(중량)
자료: 한국무역통계진흥원
5월 한국 반도체 수출 데이터 업데이트 드립니다.
업무에 도움이 되시길 바랍니다. 감사합니다.
>> 5월 한국 반도체 수출
■ 전자집적회로
- 수출액: $98.2억(+14% MoM, +47% YoY, +14% QoQ)
- 수출물량: +3% MoM, -1% YoY, +8% QoQ
- 수출단가: +10% MoM, +49% YoY, +6% QoQ
■ DRAM
- 수출액: $17.7억(+11% MoM, +48% YoY, +18% QoQ)
- 수출물량: +8% MoM, -27% YoY, -2% QoQ
- 수출단가: +3% MoM, +104% YoY, +20% QoQ
■ DRAM 모듈
- 수출액: $11.5억(+24% MoM, +195% YoY, +27% QoQ)
- 수출물량: +13% MoM, +75% YoY, +7% QoQ
- 수출단가: +10% MoM, +69% YoY, +19% QoQ
■ NAND
- 수출액: $6.9억(+11% MoM, +85% YoY, -23% QoQ)
- 수출물량: -2% MoM, +8% YoY, -25% QoQ
- 수출단가: +13% MoM, +71% YoY, +3% QoQ
■ SSD
- 수출액: $8.5억(+42% MoM, +60% YoY, +90% QoQ)
- 수출물량: +19% MoM, -14% YoY, +41% QoQ
- 수출단가: +19% MoM, +86% YoY, +34% QoQ
■ MCP
- 수출액: $27.0억(+25% MoM, +112% YoY, +17% QoQ)
- 수출물량: -3% MoM, -7% YoY, 0% QoQ
- 수출단가: +28% MoM, +128% YoY, +17% QoQ
주: 수출단가=수출액/수출물량(중량)
자료: 한국무역통계진흥원
[DB금융투자 반도체 서승연]
- NVIDIA, Computex 2024 기조연설을 통해 Blackwell Ultra GPU와 차세대 플랫폼 Rubin 출시 계획 발표
- Blackwell Ultra GPU는 25년 양산 예상. HBM3e 12단 탑재 예정
- 차세대 플랫폼인 Rubin 출시 계획 발표. R100은 4Q25 양산 예상되며 DGX, HGX 플랫폼은 1H26 양산 예상. R100은 4x 레티클 기반 TSMC N3 공정, CoWoS-L 패키징 활용할 것으로 보임. HBM4 탑재 예정
https://wccftech.com/nvidia-unveils-next-gen-rubin-rubin-ultra-blackwell-ultra-gpus-supercharged-vera-cpus/
- NVIDIA, Computex 2024 기조연설을 통해 Blackwell Ultra GPU와 차세대 플랫폼 Rubin 출시 계획 발표
- Blackwell Ultra GPU는 25년 양산 예상. HBM3e 12단 탑재 예정
- 차세대 플랫폼인 Rubin 출시 계획 발표. R100은 4Q25 양산 예상되며 DGX, HGX 플랫폼은 1H26 양산 예상. R100은 4x 레티클 기반 TSMC N3 공정, CoWoS-L 패키징 활용할 것으로 보임. HBM4 탑재 예정
https://wccftech.com/nvidia-unveils-next-gen-rubin-rubin-ultra-blackwell-ultra-gpus-supercharged-vera-cpus/
D2W hybrid bonding with 2-µm Cu interconnect pad pitch | imec
https://www.imec-int.com/en/press/imec-demonstrates-die-wafer-hybrid-bonding-cu-interconnect-pad-pitch-2mm
https://www.imec-int.com/en/press/imec-demonstrates-die-wafer-hybrid-bonding-cu-interconnect-pad-pitch-2mm
Imec-Int
D2W hybrid bonding with 2-µm Cu interconnect pad pitch | imec
Improved die-to-wafer assembly flow opens doors to logic/memory-on-logic stacking, and to optically interconnected systems-on-wafer.
Saudi Fund Joins $400 Million Financing for China AI Firm Zhipu https://www.bloomberg.com/news/articles/2024-05-31/saudi-fund-joins-400-million-financing-for-china-ai-firm-zhipu
Bloomberg.com
Saudi Fund Joins $400 Million Financing for China AI Firm Zhipu
Saudi Arabia’s Prosperity7 Ventures, LLC joined the latest financing round for up-and-coming startup Zhipu AI, becoming the first known foreign firm to back a major Chinese player in generative artificial intelligence.
Nvidia CEO Says Working to Certify Samsung’s AI Memory Chips https://www.bloomberg.com/news/articles/2024-06-04/nvidia-ceo-says-working-to-certify-samsung-s-ai-memory-chips
Bloomberg.com
Nvidia CEO Says Working to Certify Samsung’s AI Memory Chips
Nvidia Corp. is still working on the certification process for Samsung Electronics Co.’s high-bandwidth memory chips, a final required step before the Korean company can begin supplying a component essential to training AI platforms.
Nvidia’s Pitch in AI Chips Holds Echoes of Apple and iPhones https://www.bloomberg.com/news/newsletters/2024-06-04/nvidia-sales-pitch-for-ai-chips-sounds-like-apple-and-iphones
Bloomberg.com
Nvidia’s Pitch in AI Chips Holds Echoes of Apple and iPhones
At this year’s biggest gathering of AI chipmaking power players, the competition is shaping up an awful lot like the early age of smartphones. But first...