Most enterprises hold massive volumes of logs, metrics, and sensor data, but lack the necessary infrastructure to extract value from them.  While LLMs process discrete tokens in sequential context windows, machine data operates as a continuous time series.…

The push for AI-first delivery promises speed and automation, but hidden dependencies and fragile code could undo the gains.

India’s semiconductor ambitions are growing, but the path forward may not involve billion-dollar fabrication plants, just yet. While policymakers often publicise fabs as the ultimate prize, industry leaders argue that the country’s most pragmatic entry point…

Enjoy the videos and music you love, upload original content, and share it all with friends, family, and the world on YouTube.

Finding the right job has always depended on timing, skill, and opportunity. Yet traditional HR systems, built on transactional flows, often leave a gap between the talent and the opportunities they deserve. Phenom, a global HR technology company, aims to…

LPCAMM2 will deliver all the benefits of LPDDR5X memory in a form factor less than half the size.

Digital business and technology services player NTT DATA has announced a strategic collaboration agreement with Amazon Web Services (AWS) to deliver AI-powered, industry-specific contact centre solutions built on Amazon Connect.Amazon Connect is the cloud…

The countdown has begun for MLDS 2026, India’s largest and most influential Agentic AI conference for developers. Returning to Bangalore on 19–20 February 2026, the summit promises to be the definitive platform for developers, engineers, researchers, and…

When global tech giants began competing to develop large language models, the narrative often focused on English and other widely spoken languages. In India though, a country with 22 official languages and hundreds of regional dialects, AI systems face various…

Cadence Design Systems has announced a collaboration with TSMC to develop AI-driven design solutions and IP for advanced process nodes and 3D-IC packaging. The partnership aims to speed up chip development for AI and high-performance computing (HPC) applications.…