> Engineering samples of Qualcomm's next-generation flagship mobile processor, the "Snapdragon 8 Elite Gen 6 Pro," surfaced on a Chinese secondhand marketplace weeks ahead of its official announcement, revealing part of a new thermal management approach similar to the one Samsung adopted for its upcoming "Exynos 2600."
>
> A Shenzhen-based seller listed a desoldered chip identified by the part number "SM8975-100-BC" on Xianyu, China's largest online secondhand marketplace, at a provisional price of 300 RMB (about $42, roughly ¥6,700). The now-deleted listing described the item as an engineering sample removed from a test board, claimed to have bulk stock available for repair or chip-rework purposes, and stated the seller was open to price negotiation with free shipping.
>
> The listing is notable because the official announcement of the Snapdragon 8 Elite Gen 6 Pro isn't expected until Qualcomm's annual "Snapdragon Summit" event, set to open in Maui, Hawaii on September 22. Industry estimates put the unit price of the mass-production chip at over $300, making the $42 engineering sample price a striking gray-market contrast.
>
> Note: Qualcomm has officially confirmed the Summit will run September 22–24, 2026. Last year's "Snapdragon 8 Elite Gen 5" was also announced on the second day of a three-day event, so the same pattern would apply if this chip is announced within the same September 22–24 window. (Source: Qualcomm Snapdragon Summit event page)
>
> The die markings visible in photos attached to the listing offer several clues about the chip's origin. The part number "SM8975-100-BC" matches a previously reported designation for the top-tier model in Qualcomm's next flagship generation. The "-100" suffix indicates a first engineering-sample revision, and the "BC" code points to LPDDR5X memory support rather than the faster LPDDR6 expected on the production Pro model.
>
> Two lot codes stamped on the chip reveal further manufacturing details. The first unit carries the code "FC5528M5," and the second "FX602R8T." Based on packaging convention analysis, the leading "F" in both codes indicates TSMC as the foundry, likely using the N2P process node. The "C" in the first code points to Amkor's South Korea packaging facility, and the "X" in the second points to Amkor's Japan site.
>
> Note: TSMC describes N2P as a refined version of its first 2nm-class node (N2), promising roughly 5–10% better performance or 5–10% lower power consumption versus N2, with mass production planned for the second half of 2026. (Source: TSMC)
>
> Note: Amkor is one of the world's largest semiconductor back-end (OSAT) companies, and broke ground in November 2025 on an AI-chip packaging and test facility in Songdo, Incheon, South Korea. Its Japan operations trace back to J-Devices, formed from the acquisition of the former Fujitsu Semiconductor plant. (Source: Amkor Technology)
>
> The remaining characters encode dates. The "5" and "52" in the first code suggest packaging in week 52 of 2025, i.e., late December. The "6" and "02" in the second code suggest week 2 of 2026, i.e., early January. The roughly two-week gap between the two units suggests Qualcomm had working test silicon ready by late December 2025 and was rapidly packaging it across multiple Amkor facilities.
>
> The most technically significant detail visible in the images is what appears to be an internal heat spreader placed between the die and the package lid. This component looks visually similar to the "Heat Pass Block" Samsung implemented in the Exynos 2600, which earlier reporting described as potentially more effective than liquid nitrogen cooling in certain test scenarios. Qualcomm's version is also called a "Heat Slug Sheet," and appears noticeably smaller than Samsung's in the leaked images.

>
> The size difference likely stems from memory packaging constraints. Samsung's Exynos 2600 uses a compact 563-ball FBGA package for LPDDR5X, leaving room for a larger heat spreader. Qualcomm's chip, however, needs to support both LPDDR6 and LPDDR5X configurations. This pushes the design toward larger packages — a 1,295-ball FBGA for the LPDDR6 variant and a 496-ball FBGA for the LPDDR5X variant — both of which consume more package area, leaving less physical space for thermal hardware.
>
> The appearance of these engineering samples aligns with a growing body of evidence that Qualcomm's next flagship generation spans multiple die designs. A recent Snapdragon Summit teaser video briefly showed two "Snapdragon 8 Elite"-branded chips side by side, supporting months of leaks suggesting the lineup will split into Standard and Pro variants. Industry leaker Digital Chat Station claims the two chipsets carry the part numbers "SM8950" and "SM8975," both manufactured on TSMC's N2P process.
>
> The table below compares the rumored model split against Qualcomm's two most recently officially announced flagships:

Table: Snapdragon 8 Elite generations

| Generation | Process Node | CPU Configuration | Status | Announcement Timing |
|---|---|---|---|---|
| Snapdragon 8 Elite | TSMC N3E (3nm) | 2+6 Oryon, 2nd gen | Officially announced | October 21, 2024, Maui |
| Snapdragon 8 Elite Gen 5 | TSMC N3P (3nm) | 2+6 Oryon, 3rd gen | Officially announced | September 24, 2025, Maui |
| Snapdragon 8 Elite Gen 6 (SM8950) | TSMC N2P (2nm)* | 2+3+3 Oryon* | Rumored | Expected Sept 22–24, 2026 |
| Snapdragon 8 Elite Gen 6 Pro (SM8975) | TSMC N2P (2nm)*, LPDDR6 | 2+3+3 Oryon, enhanced GPU* | Rumored, this leak | Expected Sept 22–24, 2026 |

> *Unconfirmed. Based on the engineering sample markings above and leaker claims; not verified by Qualcomm.*
>
> Both chips are rumored to use a 2+3+3 CPU configuration, though the higher-end Pro model is expected to get a more powerful GPU and LPDDR6 support. Adding further complexity, Qualcomm is also reportedly working on a third Snapdragon 8 Elite Gen 6-generation chipset manufactured on Samsung Foundry's 2nm process. This chip would carry a different part number and could be a Samsung-exclusive model for devices like the Galaxy S27 Ultra.
>
> According to information obtained by Notebookcheck, sample units began shipping to OEM partners starting February 3, 2026. However, the outlet notes that the lot-code decoding cannot be independently verified through public documentation, and Qualcomm has not confirmed any details about the leaked chip.
>
> The rumored Snapdragon 8 Elite Gen 6 Pro has also appeared in an unverified AnTuTu listing, reportedly showing significant CPU and GPU performance gains over current Snapdragon 8 Elite Gen 5 devices. AnTuTu later stated the result was not uploaded to its official database, urging caution in interpreting the figures.
>
> For Qualcomm, early gray-market leaks of engineering samples aren't unprecedented in a semiconductor industry where test units routinely flow into secondary distribution channels through repair shops and rework specialists. However, the detailed markings and thermal solution confirmed in this listing represent the most concrete evidence yet of Snapdragon 8 Elite Gen 6 Pro design decisions ahead of the official announcement.
>
> At the September 22 Snapdragon Summit, full details on both the Snapdragon 8 Elite Gen 6 and Gen 6 Pro are expected, along with the next generation of the "Snapdragon X2 Elite" laptop line. Whether the heat spreader seen in these engineering samples represents the final production design will likely become clear at Qualcomm's official announcement.

aod
nfc 刷非门卡/交通卡的时候无响应

- 同步语音唤醒修复
- gpu 驱动更新到 837.0.9，未开全局 vk，流畅度应该提升不少
- 刷机脚本前置加入清除 gpu 缓存
- 更换为本人自编译的 twrp-16
- 修复其它小问题

#Исправлены различные ошибки! Например, медленная загрузка!# Решения для медленной загрузки телефонов Android

【Анализ проблемы】

Медленная загрузка телефона происходит из-за того, что init выполняет restorecon во время post-fs-data, что сбрасывает метки SELinux для всех файлов в подкаталоге /data. Это трудоемкий процесс, обычно выполняемый только во время обновления системы. В случае успеха записывается хеш, связанный с текущей системой (вычисляется на основе plat_file_contexts и постоянно хранится в xattr security.sehash). Хеш проверяется при следующей загрузке; если он совпадает с хешем системы, его не нужно сбрасывать снова. Однако в некоторых плохо спроектированных системах этот процесс может завершиться неудачей по различным причинам (например, некорректные правила SELinux, некоторые файлы, которые не могут быть восстановлены init (например, заблокированы такими инструментами, как iPlay, или другие причины, препятствующие удалению)), в результате чего хеш не записывается. Поэтому при каждой перезагрузке устройства выполняется полное восстановление системы (restorecon), что часто приводит к зависанию экрана загрузки на 1-2 минуты на первом экране (точная продолжительность зависит от количества файлов, хранящихся вне CE на вашем телефоне).

【Решение】
Используйте эмулятор терминала MT Manager, программу терминала из Aiwanji Toolbox или другую программу терминала, чтобы выполнить следующие три шага:

[Команда шага 1]
su -mm -c mount -t tmpfs tmpfs /data/adb/modules/

Пояснение к команде: Первая команда перезаписывает /data/adb/modules/ (пути к модулям Magisk и KernelSU) файлом tmpfs, чтобы предотвратить проблемы с контекстом безопасности модулей после restorecon. Без этого шага ваши модули Magisk будут потеряны. Конечно, вы можете сначала сделать резервную копию своих модулей.

ps: su -mm Глобальное пространство имен KernelSU

[Команда шага 2]
su -c /system/bin/restorecon -Rv /data

Описание команды: Выполняет операцию restorecon в каталоге /data. Этот процесс довольно длительный; дождитесь его завершения, прежде чем переходить к шагу три.

[Команда шага три]

su -c umount -l /data/adb/modules/

Описание команды: Лениво отмонтирует каталог /data/adb/modules/.

【Устранение неполадок】

1. Если при выполнении второй команды вы получили сообщение об ошибке "SELinux: Could not xxxxx", найдите файл, следующий за командой, и разблокируйте или удалите его (удаление файлов/папок в корневом каталоге не рекомендуется; вы можете разблокировать или уничтожить файлы/папки, если хотите). После устранения ошибки лучше всего перейти к шагу три, а затем повторить шаги с первого по последний. 2. Если вы правильно выполнили указанные выше команды, но проблема с медленной загрузкой по-прежнему не решена, это означает, что restorecon не является причиной. Рекомендуется проанализировать вывод команды boot dmesg, чтобы найти причину медленной загрузки.